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This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
APPLICATION MANUAL
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
Contents
1. Features of Murata Chip Trimmer Potentiometers 2. Specifications
1. Precautions in Storage
1. Considerations in Design 2. Standard Land Patterns
1. One Side Chip Mounting 2. Both Side Chip Mounting 3. Mixed Mounting of Chip Components and Leaded Components
1. Solder Paste Stenciling 2. Mounting the Product 3. Compatibility with Chip Placers 4. Sensor Level Adjustment 5. Reflow Soldering 6. Adhesive Application and Curing
Types and Characteristics of Adhesive
7. Flux Coating
Types and Characteristics of Flux
8. Wave Soldering 9. Soldering and Resoldering with a Soldering Iron 10. Cleaning
1. Adjustments 2. Automatic Adjustments 3. Lock Painting
Ex.1. Poor Contact Caused by Flux Adhesion Ex.2. Cracking of the Substrate Ex.3. Poor Contact Caused by a Deformed Driver Plate
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
1. Features of Murata Chip Trimmer Potentiometers
POZ3 Series
POZ3AN (Top adjustment type for reflow soldering)
Driver plate
Wiper Terminal (2) Resistive element (carbon) Resin substrate
Terminal (1) Terminal (3)
POZ3KN (Rear adjustment type for reflow soldering)
Driver plate Terminal (1) Terminal (2)
Wiper Terminal (3) Resistive element (carbon) Resin substrate
RVG3 Series
RVG3S08 (for reflow soldering)
Driver plate
Wiper Stopper Stopper Terminal (2)
Resistive element (cermet)
Terminal (1) Ceramic substrate
Terminal (3)
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
RVG3A08 (for flow and reflow soldering)
Driver plate
Wiper Terminal (2)
Resistive element (cermet)
Terminal (1) Ceramic substrate Terminal (3)
RVG4M Series
RVG4M (for flow and reflow soldering)
Terminal (2) Driver plate Wiper Rubber Ceramic substrate Terminal (1) Terminal (3) Resistive element (cermet)
POG5 Series
POG5 (for reflow soldering)
Gear
Case
Terminals(1) and (3) Adjustment screw
Terminal (2) Wiper Ceramic substrate Resistive element (cermet)
This is the PDF file of catalog No.R82E-2.
82E2.pdf 97.09.29
2. Specifications
POZ3 Series Series
08 RV G3 S0 8 08 58 N 3K N 3A N G5 A
RVG3 Series
RVG4M Series
POG5 Series
RV
RV
Resistive element material Terminal layout No. of terminals Adjustment method
Cermet Carbon Triangular 3 (divider type) Automatic Manual
1
Soldering
Reflow soldering Flow soldering Gold plating(nickel undercoating)
Electrode surface treatment
Solder plating (nickel undercoating) Solder plating (copper undercoating) 3 mm square
3
3
3
Size
4 mm square 5 mm square 1.50mm 1.85mm
Product thickness
2.00mm 2.10mm 3.70mm 5.00mm 0.040g(40mg)
Product weight
0.080g(80mg) 0.180g(180mg)
Cleaning
Necessary
2
Not necessary Lock painting Possible Not possible 250 pcs./reel Taping packaging (reel with a diameter of 180 mm) 500 pcs./reel 1500 pcs./reel 2000 pcs./reel 2500 pcs./reel
(2) (3) They can be used as the rheostat type by connecting lands (2) and (3). (2 terminals (rheostat type) (1) 1 (1) 2 Cleaning is needed only when there is an adhesion of foreign matter such as flux on the resistive element. 3 Only terminal (2) is gold-plated with a nickel undercoat. (2) )
RV
3
PO
Item
PO G5 H
G4 M
PO Z
PO Z
G4 M
G3 A
N
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
1. Precautions in Storage
Electrode Surface Treatment
Series POZ3 RVG3 RVG4M POG5 Electrode surface treatment Gold plating (nickel undercoating) Terminals (1) & (3): Solder plating (nickel undercoating) Terminal (2) : Gold plating (nickel undercoating) Solder plating (copper undercoating)
Storage Environment
Storage Method
Storage Period
This is the PDF file of catalog No.R82E-2.
82E2.pdf 97.09.29
1. Considerations in Design
Land Pattern Area
Both Side Chip Mounting
PCB Layout
Through hole
10 mm or more
10 mm or more
Other Considerations
10 mm or more
2. Standard Land Patterns
POZ3AN
3.1 1.15 2.2 3.0 2.4 0.1 0.25 0.1 1.85 0.1 0.1max. 1.1 (2)
1.0 (2) 3.6 0.5 0.1
3.2
(1) 0.75 1.0
(3) 0.75 (1) (3) 1.0 0.7 1.0
0.3 ( Standard tolerance: mm) in
1.9
3.8
1
4
0.1 ( Standard tolerance: mm) in
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
POZ3KN
1.1 Part to be soldered 1.15 2.2 3.0 0.5 0.1 2.4 0.1 2.1 1.85 0.1 0.25 0.1
5.4 4.4
1.0
3.0
0
1.5 (2)
0.85 0.9 0.85 3.1 (2) (1) 3.2 (3) 1.0 3.0 1.25 0.5 1.25
0.3 ( Standard tolerance:in mm)
(3) (1)
0.1 ( Standard tolerance:in mm)
RVG3S08
3.0 2.3 0.1 1.0 (2)
2
1.2 3.0
1.5 1.25 4.1
1
1.6 (2)
3.9 0.5 0.1
(1) 1.1 (3) 1.5
0.85 0.9 2.2
1 Driver plate rotation area
Part to be soldered
(1) 1.1 0.8
(3)
1.1 0.8 1.1 (0.3) 1.75
0.7 1.1 0.7
0.3 ( Standard tolerance:in mm)
0.1 ( Standard tolerance:in mm)
RVG3A08
2.2 1.2 3.0 3.0 2.4 0.1 (2) 1.6 (2) 90
4
1.85 0.1 0.3 0.1 0.7
3.5 0.5 0.1
0.65
1.5 0.6
(1) #2
(3)
1.1
1.75
#1 CLOCKWISE
#3
1.1 0.8 1.1
(0.3)
0.3 ( Standard tolerance: mm ) in
0.9
0.1 ( Standard tolerance: mm ) in
2.2
4.6
(1) 0.7 1.1 0.7 (3)
0.7
1.5
4.6
0.3 0.1
1.5
6.0
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
RVG4M08/58
4.0 (2) 1.5 3.8 2.0 0.2 0.7
2.7 0.1
4.7
1
4 M (2.4)
1.7 (2) 1.8 0.75 6.4 (1) (3) 1.1 1.1 1.6
(1)
(3) 0.55 0.1 0.35 0.1 Depth 1.7 0.6
(0.3) 2.4
1.5
0.85
1.8
0.85
0.3 ( Standard tolerance: mm) in
1.2
3.2
0.1 ( Standard tolerance: mm) in
POG5ANtype
4.8
Electric adjustment section Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5
3-1.3 2.4 1.2 2.6 3.5 5.0 3-0.8 3-0.9 3-0.7 (2) 0.5 3-1.6 (1) (3) 2.9 (2)
3.9
(3)
(1) 2.5
2.5
0.2
0.3 ( Standard tolerance: mm) in
0.1 ( Standard tolerance: mm) in
POG5HNtype
3.7
4.9 1.2
3-1.3
(2)
(1)
0.5
(3) 2.6 3-0.7 3-0.8 3-1.6
3-0.9 2.3
(3) (2)
(1)
0.1 ( Standard tolerance: mm) in
0.3 ( Standard tolerance: mm) in
2.3
Electric adjustment section Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5
4.8
2.4
4.0
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
1. One Side Chip Mounting
Reflow Soldering System
PCB Solder Paste Stenciling Chip Placing Check Reflow Soldering Cleaning Inspection
Flow Soldering System
PCB
Adhesive Application
Chip Placing
Check
Adhesive Setting PCB Reversing
Flux Application
Flow Soldering
Cleaning
Inspection
2. Both Side Chip Mounting
PCB
Solder Paste Stenciling
Chip Placing
Check
Reflow Soldering PCB Reversing
Adhesive Application
One Side Reflow/ One Side Flow System
Chip Placing Check Adhesive Setting PCB Reversing
Flux Application
Flow Soldering
Cleaning
Inspection
Both Side Reflow System
PCB
Solder Paste Stenciling
Adhesive Application
Chip Placing
Check
Reflow Soldering PCB Reversing
Solder Paste Stenciling
Chip Placing
Check
Reflow Soldering
Cleaning
Inspection
3. Mixed Mounting of Chip Components and Leaded Components
PCB
Solder Paste Stenciling
Chip Placing
Check
Reflow Soldering
Insertion of Leaded Components
PCB Reversing
Adhesive Application
Chip Placing
Check
Adhesive Setting
Flux Application PCB Reversing
Flow Soldering
Cleaning
Inspection
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
1. Solder Paste Stenciling
The Amount of Solder Paste
Electrode
Solder
Series POZ3AN, RVG3A, RVG4M, POG5 POZ3KN
Standard applying thickness 150 200 m 100 150 m
2. Mounting the Product
Dimensions of the Positioning Claws
Recommended Thickness of the Positioning Claws
Claw Product Claw
T= 2.0 mm or more
Width of the Positioning Claws
Product
Claw Terminal (3)
W Terminal (1) W= 4.0 mm or more
Correct
Incorrect
Dimensions of the Pick-up Nozzle
Recommended for the POZ3 and RVG3 Series
2.5--2.8mm 2.0mm
Recommended for the RVG4M and POG5 Series
4.0mm 2.0mm
Pressure
A nozzle whose suction surface is flat and free of notches or V grooves is recommended.
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R82E2.pdf 97.09.29
Adjustment of the Pick-up Nozzle Bottom Dead Point
Precautions in Mounting the Product
3. Compatibility with Chip Placers
When Using Commercial Chip Placers
Position Detection Methods Employed by Various Commercial Chip Placers
Detection method Typical model Manufacturer Pulsar 100 series 120C, 140C, CKD 135C Panasert MIC, MID, MA, MF Vacuum sensor system ECM series OCM-8000 series AM100 series Vacuum sensor photocell system Photocell (line sensor) system CM-60F, -62F, -60P, -62P, -92P TCM-40, -41, -60 Panasert MK , MK , MKH, MQ, MQ1, MQ2 Bulser 200 series Panasert MSH, MSH- , MV , MV -F, MPA-V TCM-1000, -1200, -3000 CP-6, CP -3 CM86C, 85C, 82C PANASONIC MAMIYA ELECTRONICS OKANO ELECTRIC MATSUSHITA ELECTRIC WORKS KYUSHU MATSUSHITA ELECTRIC SANYO PANASONIC CKD PANASONIC SANYO FUJI MACHINERY KYUSHU MATSUSHITA ELECTRIC Pitch 8mm 4mm 4mm 12mm 8mm
Image processing (CCD camera) system
Taping Versions
Series RVG4M POZ3AN RVG3 POZ3KN POG5AN POG5HN
Tape width 12mm 08mm 12mm 16mm 12mm
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
4. Sensor Level Adjustment
Adjusting Procedure
Single-line circuit
Vacuum gauge
VACUUM Vacuum pump
Vacuum sensor
Pick-up nozzle
Double-line circuit
Vacuum sensor for rectangular chips VACUUM Changeover valve Vacuum sensor for special shape chips Vacuum gauge Pick-up nozzle
Chip Placer Positioning Claws
Positioning claws
Product
Claws not provided
Claws provided
5. Reflow Soldering
Soldering Conditions
Standard Soldering Conditions
Preheating (in the air) 230 Temperature (C) 200
Soldering
Gradual cooling (in the air)
100
0
60--120 sec.
30 sec. or less (Solder melting zone)
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
6. Adhesive Application and Curing
The Amount of Adhesive to Be Applied
Standard Amounts of Adhesive Applied
Typical adhesives MR-8153RA NF-3000 Standard amounts of application 0.6 0.9mg 0.8 1.1mg
Viscosity of Adhesive
Points of Application
Adhesive 0.3 mm or more 0.3 mm or more Land PCB
Control of Adhesive Curing
2-point application
Types and Characteristics of Adhesive (1) Types of Adhesive
(3)Adhesive Application Methods
(2) Required Characteristics of Adhesive
Application method Dispenser Features A sequential application method which allows control of the amount of adhesive according to the type and shape of components. A system in which adhesive is applied at a stroke through a screen. This method can save time required for application, though it requires set-up change when PCBs are changed. In this method, no coating is allowed after components are mounted. The application of adhesive is completed at once with transfer pins. The amount of adhesive cannot be controlled in this method.
Screen Printing
Transfer Pin
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R82E2.pdf 97.09.29
Commercial Chip Mounting Adhesives
Name MR-8153RA NF-1000-6R Polyester resin NF-3000 JU-8V JU-8VD JT-5S ULTRADYNE Ingredients Acrylic resin Viscosity 5500ps 1800ps 2200ps(H) 1800ps(M) 1300ps(L) 400ps Curing temp. and time UV* * * * * * * * * * * * * * * * * * * * * 10" 150C* * * * * * * * * * * * * * * * 10"min. UV* * * * * * * * * * * * * * * * * * * * * 10 15" 140 150C * * * * * * * 10"min. UV* * * * * * * * * * * * * * * * * * * * * 10 15" 140 150C * * * * * * * 30"min. UV* * * * * * * * * * * * * * * * * * * * * 10"min. 140C* * * * * * * * * * * * * * * * 10"min. 140C* * * * * * * * * * * * * * * * 2.5'min. Pot life 2 mos.(30C) Application method Dispenser Screen printing
3 mos.(20C)
Epoxy acrylate resin Epoxy resin
1 mos.(20C)
200ps 500ps
3 mos.(20C)
#5111
Epoxy resin 1300ps Single liquid type
130C* * * * * * * * * * * * * * * * 15'
1.5 mos.(20C)
ULTRADYNE
#5111-W5
7. Flux Coating
Coating Thickness
Ingredients
Types and Characteristics of Flux (1) Functions of Flux (3) Cautions in Use
(2) Types of Flux
(4) Typical Commercial Flux
Flux name CF-210V CF-220V GX-15T AGF-150X Gammalux D-350 Chlorine content 0.08wt% 0.09wt% 0.09wt% 0.10wt% 0.08wt%
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
8. Flow Soldering
Soldering Conditions
Standard Soldering Conditions
Preheating (in the air) Soldering Gradual cooling (in the air)
Temperature (C)
250 200
100
0
60--120 sec.
5 sec. or less
Cautions in Soldering
This part tends to remain unwet. Terminations Direction of move PCB
Product
Solder flow
9. Soldering and Resoldering with a Soldering Iron
Soldering iron Product Land
Correct
PCB
Incorrect
Soldering Conditions
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
10. Cleaning
Cautions in Cleaning
POG5 Series
RVG4M Series
Recommended Cleaning Time Range for the RVG4M Series
Room temperature dipping Conditions Hot dipping Ultrasonic (below 20W/ ) Steam cleaning
Method 1 Method 2 Method 3 Method 4 Method 5
5 min. or less 2 min. or less 1 min. or less 1 min. or less 1 min. or less 1 min. or less (30 sec. or less recommended ) 30 sec. or less 30 sec. or less
POZ3 and RVG3 Series
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
1. Adjustments
Adjuster and Load
Inspection of the Adjuster
Range of Rotation of the Adjuster
Types of Adjuster
Recommended Adjusters for Manual Adjustments
Series Recommended adjusters Manufacturer VESSEL MFG. POZ3 TORAY INDUSTRIES, INC. VESSEL MFG. RVG3S08/3A08 TORAY INDUSTRIES, INC. VESSEL MFG. VESSEL MFG. POG5 FUTABA TOOL MFG. Trade name NO.9000 1.7 30 TORAY TORAYCERAM ADJUSTER SA-2225 NO.9000 1.7 30 TORAY TORAYCERAM ADJUSTER SA-2225 NO.9000 NO.9000 DA54 2.6 30 1.3 30 MURATA's trade name KMPOT12V KMPOT13T KMPOT12V KMPOT13T KMPOT15V KMPOT16V Head shape Cross Flat blade (semicircular end) Cross Flat blade (semicircular end) Flat blade Flat blade Flat blade
RVG4M
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
2. Automatic Adjustments
Guiding Mechanism for Position Error Correction
Bit for automatic adjustment (JB-2225)
Product
PCB Design position
Actual position 0.7mm (Offset from the bit center)
Errors up to correctable
0.7 mm
PCB
Recommended Bit for Automatic Adjustments
TORAY TORAYCERAM ADJUSTER JB-2225 Dimensions
1.0 R1.20 0.05 2.2 0.7 5 20 1.0 1.5 0.40
0.05 0.03
(in mm)
For further information on dimensions, contact TORAY INDUSTRIES, INC.
Recommended Adjuster Bit for Automatic Adjustment
Series POZ3 RVG3S08 RVG3A08 Recommended adjuster bit Manufacturer TORAY Trade name TORAY TORAYCERAM ADJUSTER JB-2225 MURATA's trade name KMPOT31T Head shape Flat blade (semicircular end)
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
3. Lock Painting
Paint Ingredients
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
Ex.1. Poor Contact Caused by Flux Adhesion
Phenomenon
Prevention
PCB Layout
Through hole
10 mm or more
10 mm or more
10 mm or more
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
Ex.2. Cracking of the Substrate
Phenomenon
Prevention
Perforation
Slit
V slot
Ex.3. Poor Contact Caused by a Deformed Driver Plate
Phenomenon
Prevention
This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
Note:
1. Export Control For customers outside Japan Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. For customers in Japan For products which are controlled items subject to "the Foreign Exchange and Foreign Trade Control Law" of Japan, the export license specified by the law is required for export. 2. Please contact our sales representatives or engineers before using our products listed in this catalog for the applications requiring especially high reliability what defects might directly cause damage to other party's life, body or property (listed below) or for other applications not specified in this catalog. Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Transportation equipment (automobiles, trains, ships,etc.) Traffic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 3. Product specifications in this catalog are as of September 1997, and are subject to change or stop the supply without notice. Please confirm the specifications before ordering any product. If there are any questions, please contact our sales representatives or engineers. 4. The categories and specifications listed in this catalog are for information only. Please confirm detailed specifications by checking the product specification document or requesting for the approval sheet for product specification, before ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us.
http://www.murata.co.jp/
2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-951-9111 1874 Sumiyoshi-cho Kizuki, Nakahara-ku Kawasaki, 211-0021, Japan Phone:81-44-422-5153 Fax:81-44-433-0798

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